ASMPT Limited functions as an investment holding enterprise, globally focused on the development, production, and sale of advanced machinery, specialized tools, and crucial materials for the semiconductor and electronics assembly sectors. Its operations are bifurcated into two primary divisions: Semiconductor Solutions and Surface Mount Technology Solutions. The company provides a wide array of equipment for various semiconductor processes, spanning from deposition and wafer separation to automated optical inspection (AOI/FOL), die attachment, wire bonding, dispensing, and encapsulation, alongside solutions for CMOS image sensors (CIS). Additionally, it delivers systems for singulation, trimming, forming, LED testing, sorting, taping, sintering, and complete test and finish handling. Beyond its hardware offerings, ASMPT furnishes cutting-edge technological solutions such as surface mount technologies (SMT), advanced packaging, encapsulation, and specialized platforms for Micro-Electro-Mechanical Systems (MEM), power, LED/opto, and photonics. Its expertise further extends to Chip-on-Board (COB) and stacked die configurations, intelligent SMT factory solutions, and image sensor applications. The company also offers supplementary agency and logistics services. Founded in 1975, ASMPT Limited, headquartered in Tsing Yi, Hong Kong, was previously known as ASM Pacific Technology Limited before officially changing its name in June 2022.
