Founded in 1997 and headquartered in Hsinchu, Taiwan, ChipMOS TECHNOLOGIES Inc. specializes in the research, development, manufacturing, and sale of advanced, high-precision integrated circuits. The company also delivers comprehensive assembly and testing services for these components. Operating across Taiwan, mainland China, Japan, Singapore, and other international markets, ChipMOS segments its operations into Testing; Assembly; Testing and Assembly for LCD, OLED and other Display Panel Driver Semiconductors; Bumping; and Other services. Its extensive back-end offerings encompass engineering, wafer probe, and final testing for memory, logic, and mixed-signal semiconductors. Additionally, it performs package assembly for these semiconductors using both leadframe and organic substrate technologies. For display panel driver semiconductors, including those for LCD and OLED, the company provides gold bumping, reel-to-reel assembly, and specialized testing. These crucial semiconductor components find applications in diverse sectors such as personal computing, gaming consoles, communication devices, mobile handsets, tablets, consumer electronics, automotive and industrial systems, and various display technologies.
